Technical Library

Table of Contents



Photoresist

Process to Produce High Aspect Ratio Electroplated Copper Pillars on 300 mm Wafers
C. Chen, S. Lee, B. Plass, and G. Pawlowski, AZ Electronic Materials USA Corp.,
Warren W. Flack, Ha-Ai Nguyen, Ultratech, Inc., T. Ritzdorf, D. Ericksen, Semitool, Inc. (IMAPS 2008)

Characterization of a Thick Copper Pillar Bump Process
Warren W. Flack, Ha-Ai Nguyen, Ultratech, Inc., Elliott Capsuto, Craig McEwen
Shin-Etsu MicroSi, Inc. (APM 2007)

Performance of a 55 Micron Copper Pillar Bump Process Using a Positive Thick Chemically Amplified Photoresist
Dennis Crapse, Freescale Semiconductor, Warren W. Flack, Ha-Ai Nguyen, Ultratech, Inc., Elliott Capsuto, Craig McEwen, Shin-Etsu MicroSi, Inc. (SPIE 2007)

Characterization of a High Photospeed Positive Thick Photoresist for Lead Free Solder Electroplating
Warren W. Flack, Ha-Ai Nguyen, Ultratech, Inc., Yasushi Washio, Mitsuaki Ohgake, Christopher Rosenthal, Tokyo Ohka Kogyo Co., Ltd (SPIE 2007)

Characterization Study of an Aqueous Developable Photosensitive Polyimide on
300 mm Wafers

Warren W. Flack, Scott Kulas, Ultratech, Inc., Craig Franklin, HD Microsystems (SPIE 2001)

Process Improvements for Ultra-Thick Photoresist Using a Broadband Stepper
Warren W. Flack, Ha-Ai Nguyen, Ultratech, Inc., Elliott Capsuto, ShinEtsuMicroSi, Inc. (SPIE 2001)

Process Characterization of an Aqueous Developable Photosensitive Polyimide on a Broadband Stepper
Warren W. Flack, Scott Kulas, Ultratech, Inc., Craig Franklin, HD Microsystems (SPIE 2000)

Process Characterization of One Hundred Micron Thick Photoresist Films

Warren W. Flack, Sylvia White, Bradley Todd, Ultratech, Inc. (SPIE 1999)

Reticle

High Optical Density Photomasks For Large Exposure Applications
Dan Schurz, Warren W. Flack, Makoto Nakamura, Ultratech, Inc. (BACUS 2000)

Reticle Defect Printability and Photoresist Modeling of Contact Structures
Warren W. Flack, Dan Schurz, Richard Lee, Calvin Ho, Ultratech, Inc. (SPIE 1998)


DSA

Verification of Back-to-Front Side Alignment for Advanced Packaging
Warren W. Flack, Manish Ranjan, Gareth Kenyon, Robert Hsieh, Ultratech, Inc., John Slabbekoorn, Andy Miller, IMEC (IWLPC 2012)

Development and Characterization of a 300mm Dual-Side Alignment Stepper
Warren W. Flack, Emily M. True, Robert Hsieh, Detlef Fuchs, Ray Ellis, Ultratech, Inc. (SPIE 2007)


Packaging

Optimization Of Through Si Via Last Lithography For 3D Packaging
Warren W. Flack, Robert Hsieh, Gareth Kenyon, Ultratech, Inc., John Slabbekoorn, Bert Tobback, Tom Vandeweyer, Andy Miller, IMEC (IWLPC 2015)

Bosch Process Characterization For Donut TSV’s
John Slabbekoorn, Bart Schepers, Khashayar Babaei Gavan, Stefano Sardo,
Stefaan Van Huylenbroeck, Tom Vandeweyer, Andy Miller, Kenneth June Rebibis, IMEC, Warren W. Flack, Robert Hsieh, Manish Ranjan, Ultratech, Inc. (IWLPC 2014)

Microbump Lithography For 3D Stacking Applications
Patrick Jaenen, John Slabbekoorn, Andy Miller, IMEC, Warren W. Flack, Manish Ranjan, Gareth Kenyon, Robert Hsieh, Ha-Ai Nguyen, Ultratech, Inc. (IWLPC 2013)

Lithography Challenges For Leading Edge 3D Packaging Applications
Warren W. Flack, Manish Ranjan, Gareth Kenyon, Robert Hsieh, Ultratech, Inc. John Slabbekoorn, Andy Miller, IMEC (IWLPC 2011)


Fanout

Lithography Technique to Reduce the Alignment Errors from Die Placement in
Fan-out Wafer Level Packaging Applications

Warren Flack, Robert Hsieh, Gareth Kenyon, Khiem Nguyen, Manish Ranjan, Ultratech Inc., Nuno Silva, Paulo Cardoso, Eoin O Toole, Nanium S.A., Rainer Leuschner, Werner Robl, Thorsten Meyer, Infineon Technology AG (ECTC 2011)

Lithography Challenges and Considerations for Emerging Fan-out Wafer Level Packaging Applications
Robert L. Hsieh, Detlef Fuchs, Warren W. Flack, and Manish Ranjan, Ultratech Inc., Rainer Leuschner, Werner Robl, and Thorsten Meyer, Infineon Technology AG (IXLPC 2009)


Large Area Interposer

Large Area Interposer Lithography
Warren Flack, Robert Hsieh, Gareth Kenyon, Manish Ranjan, Ultratech Inc., John Slabbekoorn, Andy Miller, Eric Beyne, IMEC, Medhat Toukhy, PingHung Lu, Yi Cao, Chunwei Chen, AZ Electronic Materials USA Corp. (ECTC 2014)


Superfast

Characterization Of Stress And Topology In WLP Processes Using CGS Interferometry
David M. Owen, Ph.D., Doug Anberg, Shrinivas Shetty, Warren Flack, Ultratech, Inc. (IWLPC 2014)