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Coming Soon in 3D
By Francoise von Trapp
“The AP Roadshow visits Ultratech in San Jose,
California. It was a picture-perfect July day to visit Ultratech’s
San Jose, CA, campus, world headquarters for the North America-based
OEM. Below are photos of our facility tour at Ultratech.”
Click on the link to see full article: Advanced Packaging
Magazine ,
October 2007
Finding Your Niche
By Gail Flower
“One of the most difficult things for companies involves
finding what they do best, which area or niche they want to serve.
For some, it’s a horizontal niche - seeing out the most difficult
area to supply in several markets. For others it’s a vertical
slice of an already-specialized field. Some want to be the top
supplier, others are satisfied with second. No matter what focus
a company takes, this philosophy should filter down to all employees
so all efforts are coordinated and purposeful.”
Click on the link to see full article: Solid
State Technology ,
October 2007
Thick Copper Pillar Bump Fabrication
By Warren W. Flack
and Ha-Ai Nguyen, Ultratech, Inc., Elliott Capsuto and Craig McEwen,
Shin-Etsu MicroSi, Inc.
“Copper pillar bumps were introduced in 2006 by Intel in
their 65-nm “Yonah” microprocessor. Wafer bump foundries
and semiconductor manufacturers are actively evaluating this new
technology. Integration of photolithography and electroplating
is critical to the fabrication process.”
Click on the link to see full article: Advanced
Packaging Magazine ,
November 2007
Fifty
Years on, IC Industry’s Greatest Invention is
Itself
EXECUTIVE OVERVIEW
By Katherine Derbyshire
“Founding a semiconductor magazine, or company, in 1957
required a leap of faith. Yet for more than five decades, the semiconductor
industry has exceeded all supposed limits to its growth and innovative
potential. In the process, it has continually reinvented itself,
from delicate hand assembly of the first ICs to today’s highly
automated manufacturing.”
Click on the link to see full article: Solid State Technology ,
November 2007 – 50 th Anniversary Issue
50th
Anniversary Perspectives
By Jeffrey Demmin
“On the occasion of Solid State Technology’s 50th
anniversary, we asked our Editorial Advisory Board and other luminaries
to opine on the past 50 years and future 50 years of semiconductor
manufacturing. We asked them a series of questions. Their varied
answers will surprise you.”
Click on the link to see full article: Solid State Technology ,
November 2007 – 50 th Anniversary Issue
Stepper Technology Enables Wafer-level Packaging Adoption
By
Manish Ranjan, Ultratech Inc.
“Semiconductor assembly and test service (SATS) houses,
packaging foundries, and integrated device manufacturers (IDMs)
are increasingly turning to wafer-level packaging (WLP) to address
the demand for miniaturization, lower cost, enhanced functionality,
and higher reliability in today's personal digital devices.”
Click on the link to see full article: Advanced Packaging
Magazine – E-newsletter,
December 5, 2007
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