Ultratech's award winning Saturn Spectrum 300e² is specifically designed to address technical and financial considerations for 300 mm advanced packaging lithography. To realize the benefits associated with the shift to 300 mm wafer sizes, device manufacturers and wafer foundries are equipping their fabs with the most sophisticated equipment. The Spectrum series is also ideally suited for exposing resists for additional post passivation applications such as stress buffer layers, transmission lines and on chip integrated passive formations.

Key technical challenges for 300 mm advanced packaging lithography include controlling CD uniformity and maintaining alignment specifications across the wafer. The Saturn Spectrum 300e² provides high wafer plane irradiance, superior resolution and enhanced alignment capability. In addition, this tool lowers overall operating costs by providing high production throughput and reducing the mask consumption costs. Superior technical performance and financial cost savings make this tool the intelligent choice for both device manufacturers and wafer foundries.

Key Features and Benefits:

• Broadband illumination capability enables exposure of i-, gh- and ghi-line resists on the same lithography tool
• Machine Vision System (MVS), a pattern recognition-based alignment system, eliminates the need for dedicated alignment targets and simplifies process integration
• Universal wafer size handling capability provides increased operational flexibility
• Wafer edge processing solutions enable easy edge processing of both positive and negative resists for electroplated bump applications
• Dual lamp illuminator configuration provides the industry's highest wafer plane irradiance enabling high throughput while exposing thick resists

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