Designed to optimize productivity for leading-edge 300mm wafer fabs, the AP300 system integrates the processing advantages associated with Ultratech’s industry-leading advanced packaging lithography equipment with the productivity benefits of the company’s new Unity PlatformTM. Ultratech’s AP300 supports a lower cost-of-ownership strategy due to significant throughput enhancements, higher reliability, and superior alignment and illumination systems. In addition, utilizing non-contact 1X projection imaging technology greatly reduces the risk of lithography-related yield losses, while also providing the unique capabilities required for processing leading-edge advanced packaging devices.

Key Features and Benefits:

• Broadband illumination capability enables exposure of i-, gh- and ghi-line resists
• Patented Machine Vision System (MVS) capability eliminates the need for dedicated alignment targets and simplifies process integration
• Fully automatic wafer change supports 200 mm and 300 mm wafers
• Improved wafer edge exposure and wafer edge exclusion capability provide customer productivity enhancements
• Industry’s best equipment uptime along with self diagnostic capability and enhanced host communications
• New platform enables a 20% productivity improvement, thereby supporting a lower cost-of-ownership strategy

Unity Platform
Ultratech recently unveiled its breakthrough Unity PlatformTM, which will serve as a universal foundation for Ultratech’s future-generation tools. Specifically designed to meet customers’ emerging performance, productivity and cost-of-ownership (CoO) requirements, the Unity Platform features a customer-configurable design that will support flexible manufacturing requirements as well as tool extendibility for multiple device generations.

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