-Glossary
-Technical Papers

The following papers are presented in the Adobe Portable Document Format (.pdf). Select an article and it will be downloaded to your computer by your browser. You may then open the article using the Adobe Acrobat Reader. Our Glossary provides definitions for many of the technical terms used within these papers and our technology area.

Table of Contents


DUV

The Development of 157nm Small Field and Mid-Field MicroSteppers
Ron E. Miller, Paul Bischoff, Roger Sumner, Steve Bowler, Warren W. Flack, Galen Fong

Mix-and-Match 

Efficient Overlay Optimization of Stepper Correctables 
Warren W. Flack, Susan Avlakeotes, David Chen, and Gary E. Flores, Ultratech, Inc. (SPIE, 1996) 

Application of Pattern Recognition in Mix-and-Match Lithography 
Warren W. Flack, Gary E. Flores and Thinh Tran, Ultratech, Inc. (SPIE, 1995) 

An Optimized Registration Model for 2:1 Stepper Field Matching 
Warren W. Flack and Gary E. Flores, Ultratech, Inc. 
Joseph C. Pellegrini, New Visions Systems, Mark Merrill, KLA Instruments Corporation (SPIE, 1994) 

The Implementation and Characterization of Advanced Mix-and-Match Lithography 
Gary Flores, Warren Flack & John Cossins, Ultratech, Inc. (SEMICON/Europa, 1994) 

Registration Modeling and Simulation in Advanced Mix-and-Match Lithography 
Warren W. Flack and Gary E. Flores, Ultratech, Inc. 
Joseph C. Pellegrini, New Vision Systems, Mark Merrill, KLA Instruments Corporation (3-Beam, 1994) 

Registration Simulations and Sampling Strategies for Large Field Lithography 
Gary E. Flores and Warren W. Flack, Ultratech, Inc. 
Joseph C. Pellegrini, New Visions Systems, Mark Merrill, KLA Instruments Corporation (OCG Interface, 1994) 

A Reticle Correction Technique to Minimize Lens Distortion Effects 
Warren W. Flack, Gary E. Flores, Alan Walther and Manny Ferreira, Ultratech, Inc. (BACUS Symposium, 1994) 
 
Lithographic Performance of a New Generation i-line Optical System: A Comparative Analysis 
Gary Flores, Warren Flack, Lynn Dwyer, Ultratech, Inc. (SPIE, 1993) 
 

Fab Retooling 

Monitoring and Diagnostic Techniques for Control of Overlay in Steppers 
Gary E. Flores, Warren W. Flack, Susan Avlakeotes Ultratech, Inc., Mark Merrill, KLA Instruments Corporation (SPIE, 1995) 
 
Process Control of Stepper Overlay Using Multivariate Techniques 
Gary E. Flores, Warren W. Flack, Susan Avlakeotes and Bob Martin, Ultratech, Inc. (OCG Interface, 1995) 
  
Photoresist Thin Film Effects on Alignment Process Capability 
Gary E. Flores, Ultratech, Inc., Warren W. Flack, TRW Inc. (SPIE, 1993) 

  
Packaging and Polyimide 

A Comparison of New Thick Photoresists for Solder Bumping
Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc., Mark Neisser, Ernesto Sison, Ping Hung Lu, Bob Plass AZ Electronic Materials USA Corp., Toshimichi Makii, Yoshio Murakami AZ Electronic Materials (Japan) K.K. (2005)

Characterization of 100 Micron Thick Positive Photoresist on 300 mm Wafers
Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc., Elliott Capsuto Shin-Etsu MicroSi, Inc., Kelly Abreau STEAG Hamatech USA (2005)

Characterization of an Ultra-Thick Positive Photoresist for Electroplating Applications
Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc., Elliott Capsuto Shin-Etsu MicroSi, Inc.

Process Characterization of an Aqueous Developable Photosensitive Polyimide on a Broadband Stepper
Warren W. Flack, Scott Kulas, Ultratech, Inc., Craig Franklin HD Microsystems

A Low Cost Lithography Process for Flip-Chip Applications in Advanced Packaging Industry 
Peter Cheang, Wolfgang Staud, Gary Newman, Ultratech, Inc. (Advanced Manufacturing Technologies Seminar, 1997) 
  
An Investigation of the Properties of Photosensitive Polyimide Films 
Warren W. Flack, Gary E. Flores, Lorna Christensen, and Gary Newman, Ultratech, Inc. (SPIE, 1996) 

Optimization of Photosensitive Polyimide Process for Cost Effective Packaging 
Peter Cheang, Lorna Christensen, Corinne Reynaga, Ultratech, Inc. (Surface Mount Technology Seminar, 1996) 

An Optimized Process for Ultrathick Photosensitive Polyimide Applications 
Peter Cheang and Gary Newman, Ultratech, Inc., Dan O. Murray, DuPont Electronics (SEMICON/Taiwan, 1996)

High Optical Density Photomasks For Large Exposure Applications 
Dan Schurz, Warren W. Flack, Makoto Nakamura Ultratech, Inc.

Process Improvements for Ultra-Thick Photoresist Using a Broadband Stepper
Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc., Elliott Capsuto ShinEtsuMicroSi, Inc.

Characterization of a Novel Photoresist Redistribution Material for Advanced Packaging Applications
Warren W. Flack Ultratech, Inc., Elliott Capsuto ShinEtsuMicroSi, Inc.
 

Thin Film Heads 

An Investigation of the Properties of Thick Photoresist Films 
Gary E. Flores, Warren W. Flack, Elizabeth Tai, Ultratech, Inc. (SPIE, 1994) 

Lithographic Performance in Thick Photoresist Applications 
Gary E. Flores, Warren W. Flack, Elizabeth Tai, Ultratech, Inc., Chris A. Mack, FINLE Technologies (OCG Microlithography Interface Conference, 1993) 
 

MEMS 

Dual Side Lithography Measurement, Precision and Accuracy
Daniel Schurz, Warren W. Flack, Robert L. Hsieh Ultratech, Inc.(2005)

Process Characterization of an Ultra-Thick Strippable Photoresist Using a Broadband Stepper
Warren W. Flack, Scott Kulas, Ultratech, Inc., David W. Minsek, MicroChem Corp. (SPIE 2000)

Thick Photoresist Imaging Using A Three Wavelength Exposure Stepper
Bradley Todd, Warren W. Flack, Sylvia White (SPIE MEMS 1999 )

 Process Characterization of One Hundred Micron Thick Photoresist Films
Warren W. Flack, Sylvia White, Bradley Todd, Ultratech, Inc. (SPIE 1999)

The Optimization and Characterization of Ultra-Thick Photoresist Films 
Warren W. Flack, Warren P. Fan and Sylvia White, Ultratech (SPIE, 1998) 

Advanced Simulation Techniques for Thick Photoresist Lithography 
Warren W. Flack, Gary Newman Ultratech, Inc. 
D. Bernard, J. Rey, Y. Granik, V. Boksha, Technology Modeling Associates (SPIE, 1997)

High Optical Density Photomasks For Large Exposure Applications 
Dan Schurz, Warren W. Flack, Makoto Nakamura Ultratech, Inc. 

1X Lithography for a Micromachined Accelerometer 
Zaulfquar Mohammed, Jeff Farash, Barbara Berthold, Mike Murphy, Analog Devices, Bradley Todd, Geoff Phillips, Ultratech, Inc. (SPIE Micromachining & Microfabrication Symposium, 1997) 
  
Photolithography Challenges for the Micromachining Industry 
David Craven, Ultratech, Inc. (BACUS Symposium, 1996) 

Imaging and Resist Technologies for the Micromachining Industry 
David Craven, Ultratech, Inc. (SPIE Micromachining & Microfabrication Symposium, 1996) 
 

Reticles 

Simulation Study of Reticle Enhancement Technology Applications for 157 nm Lithography
Dan Schurz, Warren W. Flack, Linard Karklin (BACUS 2001)

The Effects of Mask Error Factor on Process Window Capability
Dan Schurz, Warren W. Flack, Simon Cohen, Tom Newman, Khiem Nguyen (BACUS Symposium 1999)

Reticle Defect Printability and Photoresist Modeling of Contact Structures 
Warren W. Flack, Dan Schurz, Richard Lee and Calvin Ho, Ultratech (SPIE, 1998) 

The Printability of 1X Reticle Defects for Submicron Design Rules 
Dan Schurz, Warren W. Flack, Gary Newman, Ultratech, Inc. (BACUS Symposium, 1997) 

Simulation of Sub-Halfmicron Mask Defect Printability at 1X Reticle Magnification 
Warren W. Flack, Gary Newman, Dan Schurz, Ultratech, Inc. (SPIE, 1997) 

Subhalf-Micron Mask Defect Detectability and Printability at 1X Reticle Magnification 
Dan Schurz, Warren W. Flack, Gary Newman, Ultratech, Inc. (BACUS Symposium, 1996) 

Optical Networking 

Lithographic Chip Identification: Meeting the Failure Analysis Challenge
Lynn Dwyer, Kevin Riddell, Ultratech, Inc., Warren Flack, TRW Inc.

300 mm

Characterization Study of an Aqueous Developable Photosensitive Polyimide on 300 mm Wafers
Warren W. Flack, Scott Kulas, Ultratech, Inc., Craig Franklin HD Microsystems

 
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