Fab Retooling
Monitoring and Diagnostic Techniques
for Control of Overlay in Steppers
Gary E. Flores, Warren W. Flack, Susan Avlakeotes Ultratech,
Inc., Mark Merrill, KLA Instruments Corporation (SPIE, 1995)
Process Control of Stepper Overlay
Using Multivariate Techniques
Gary E. Flores, Warren W. Flack, Susan Avlakeotes and Bob Martin,
Ultratech, Inc. (OCG Interface, 1995)
Photoresist Thin Film Effects on
Alignment Process Capability
Gary E. Flores, Ultratech, Inc., Warren W. Flack, TRW Inc. (SPIE,
1993)
Packaging
and Polyimide
A Comparison
of New Thick Photoresists for Solder Bumping
Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc., Mark Neisser,
Ernesto Sison, Ping Hung Lu, Bob Plass AZ Electronic Materials
USA Corp., Toshimichi Makii, Yoshio Murakami AZ Electronic Materials
(Japan) K.K. (2005)
Characterization
of 100 Micron Thick Positive Photoresist on 300 mm Wafers
Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc., Elliott Capsuto
Shin-Etsu MicroSi, Inc., Kelly Abreau STEAG Hamatech USA (2005)
Characterization
of an Ultra-Thick Positive Photoresist for Electroplating Applications
Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc., Elliott Capsuto
Shin-Etsu MicroSi, Inc.
Process Characterization
of an Aqueous Developable Photosensitive Polyimide on a Broadband
Stepper
Warren W. Flack, Scott Kulas, Ultratech, Inc., Craig Franklin
HD Microsystems
A Low Cost Lithography Process
for Flip-Chip Applications in Advanced Packaging Industry
Peter Cheang, Wolfgang Staud, Gary Newman, Ultratech, Inc. (Advanced
Manufacturing Technologies Seminar, 1997)
Process Improvements
for Ultra-Thick Photoresist Using a Broadband Stepper
Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc., Elliott Capsuto
ShinEtsuMicroSi, Inc.
Characterization of a Novel
Photoresist Redistribution Material for Advanced Packaging
Applications
Warren W. Flack Ultratech, Inc., Elliott Capsuto ShinEtsuMicroSi,
Inc.
Thin Film
Heads
Lithographic Performance in Thick
Photoresist Applications
Gary E. Flores, Warren W. Flack, Elizabeth Tai, Ultratech, Inc.,
Chris A. Mack, FINLE Technologies (OCG Microlithography Interface
Conference, 1993)
MEMS
Dual Side Lithography
Measurement, Precision and Accuracy
Daniel Schurz, Warren W. Flack, Robert L. Hsieh Ultratech, Inc.(2005)
Process Characterization
of an Ultra-Thick Strippable Photoresist Using a Broadband
Stepper
Warren W. Flack, Scott Kulas, Ultratech, Inc., David W. Minsek,
MicroChem Corp. (SPIE 2000)
Thick Photoresist Imaging
Using A Three Wavelength Exposure Stepper
Bradley Todd, Warren W. Flack, Sylvia White (SPIE MEMS 1999 )
Process Characterization
of One Hundred Micron Thick Photoresist Films
Warren W. Flack, Sylvia White, Bradley Todd, Ultratech, Inc.
(SPIE 1999)
The Optimization and Characterization
of Ultra-Thick Photoresist Films
Warren W. Flack, Warren P. Fan and Sylvia White, Ultratech (SPIE,
1998)
Advanced Simulation Techniques
for Thick Photoresist Lithography
Warren W. Flack, Gary Newman Ultratech, Inc.
D. Bernard, J. Rey, Y. Granik, V. Boksha, Technology Modeling
Associates (SPIE, 1997)
High Optical Density Photomasks
For Large Exposure Applications
Dan Schurz, Warren W. Flack, Makoto Nakamura Ultratech, Inc.
1X Lithography for a Micromachined
Accelerometer
Zaulfquar Mohammed, Jeff Farash, Barbara Berthold, Mike Murphy,
Analog Devices, Bradley Todd, Geoff Phillips, Ultratech, Inc.
(SPIE Micromachining & Microfabrication Symposium, 1997)
Photolithography Challenges for
the Micromachining Industry
David Craven, Ultratech, Inc. (BACUS Symposium, 1996)
Imaging and Resist Technologies
for the Micromachining Industry
David Craven, Ultratech, Inc. (SPIE Micromachining &
Microfabrication Symposium, 1996)
Reticles
Reticle Defect Printability and
Photoresist Modeling of Contact Structures
Warren W. Flack, Dan Schurz, Richard Lee and Calvin Ho, Ultratech
(SPIE, 1998)
The Printability of 1X Reticle
Defects for Submicron Design Rules
Dan Schurz, Warren W. Flack, Gary Newman, Ultratech, Inc. (BACUS
Symposium, 1997)
Simulation of Sub-Halfmicron Mask
Defect Printability at 1X Reticle Magnification
Warren W. Flack, Gary Newman, Dan Schurz, Ultratech, Inc. (SPIE,
1997)
Subhalf-Micron Mask Defect Detectability
and Printability at 1X Reticle Magnification
Dan Schurz, Warren W. Flack, Gary Newman, Ultratech, Inc. (BACUS
Symposium, 1996)
300 mm
Characterization Study of an
Aqueous Developable Photosensitive Polyimide on 300 mm Wafers
Warren W. Flack, Scott Kulas, Ultratech, Inc., Craig Franklin
HD Microsystems
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