DUV
The
Development of 157nm Small Field and Mid-Field MicroSteppers
Ron E. Miller, Paul Bischoff, Roger Sumner, Steve Bowler, Warren
W. Flack, Galen Fong
Mix-and-Match
Efficient Overlay
Optimization of Stepper Correctables
Warren W. Flack, Susan Avlakeotes, David Chen, and Gary E. Flores,
Ultratech, Inc. (SPIE, 1996)
Application of Pattern
Recognition in Mix-and-Match Lithography
Warren W. Flack, Gary E. Flores and Thinh Tran, Ultratech,
Inc. (SPIE, 1995)
An Optimized Registration
Model for 2:1 Stepper Field Matching
Warren W. Flack and Gary E. Flores, Ultratech, Inc.
Joseph C. Pellegrini, New Visions Systems, Mark Merrill, KLA Instruments
Corporation (SPIE, 1994)
The Implementation
and Characterization of Advanced Mix-and-Match Lithography
Gary Flores, Warren Flack & John Cossins, Ultratech,
Inc. (SEMICON/Europa, 1994)
Registration Modeling
and Simulation in Advanced Mix-and-Match Lithography
Warren W. Flack and Gary E. Flores, Ultratech, Inc.
Joseph C. Pellegrini, New Vision Systems, Mark Merrill, KLA Instruments
Corporation (3-Beam, 1994)
Registration Simulations
and Sampling Strategies for Large Field Lithography
Gary E. Flores and Warren W. Flack, Ultratech, Inc.
Joseph C. Pellegrini, New Visions Systems, Mark Merrill, KLA Instruments
Corporation (OCG Interface, 1994)
A Reticle Correction
Technique to Minimize Lens Distortion Effects
Warren W. Flack, Gary E. Flores, Alan Walther and Manny Ferreira,
Ultratech, Inc. (BACUS Symposium, 1994)
Lithographic Performance of a New
Generation i-line Optical System: A Comparative Analysis
Gary Flores, Warren Flack, Lynn Dwyer, Ultratech, Inc. (SPIE,
1993)
Fab Retooling
Monitoring and Diagnostic
Techniques for Control of Overlay in Steppers
Gary E. Flores, Warren W. Flack, Susan Avlakeotes Ultratech,
Inc., Mark Merrill, KLA Instruments Corporation (SPIE, 1995)
Process Control of Stepper Overlay
Using Multivariate Techniques
Gary E. Flores, Warren W. Flack, Susan Avlakeotes and Bob Martin,
Ultratech, Inc. (OCG Interface, 1995)
Photoresist Thin Film Effects on Alignment
Process Capability
Gary E. Flores, Ultratech, Inc., Warren W. Flack, TRW Inc.
(SPIE, 1993)
Packaging and Polyimide
A Comparison of New Thick Photoresists for Solder Bumping
Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc., Mark Neisser, Ernesto
Sison, Ping Hung Lu, Bob Plass AZ Electronic Materials USA Corp.,
Toshimichi Makii, Yoshio Murakami AZ Electronic Materials (Japan)
K.K. (2005)
Characterization of 100 Micron Thick Positive Photoresist on 300
mm Wafers
Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc., Elliott Capsuto
Shin-Etsu MicroSi, Inc., Kelly Abreau STEAG Hamatech USA (2005)
Characterization of
an Ultra-Thick Positive Photoresist for Electroplating Applications
Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc., Elliott Capsuto
Shin-Etsu MicroSi, Inc.
Process
Characterization of an Aqueous Developable Photosensitive Polyimide
on a Broadband Stepper
Warren W. Flack, Scott Kulas, Ultratech, Inc., Craig Franklin
HD Microsystems
A Low Cost Lithography
Process for Flip-Chip Applications in Advanced Packaging Industry
Peter Cheang, Wolfgang Staud, Gary Newman, Ultratech, Inc.
(Advanced Manufacturing Technologies Seminar, 1997)
An Investigation of the Properties
of Photosensitive Polyimide Films
Warren W. Flack, Gary E. Flores, Lorna Christensen, and Gary Newman,
Ultratech, Inc. (SPIE, 1996)
Optimization of
Photosensitive Polyimide Process for Cost Effective Packaging
Peter Cheang, Lorna Christensen, Corinne Reynaga, Ultratech,
Inc. (Surface Mount Technology Seminar, 1996)
An Optimized Process for Ultrathick
Photosensitive Polyimide Applications
Peter Cheang and Gary Newman, Ultratech, Inc., Dan O. Murray,
DuPont Electronics (SEMICON/Taiwan, 1996)
High Optical Density Photomasks
For Large Exposure Applications
Dan Schurz, Warren W. Flack, Makoto Nakamura Ultratech,
Inc.
Process Improvements for
Ultra-Thick Photoresist Using a Broadband Stepper
Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc., Elliott Capsuto
ShinEtsuMicroSi, Inc.
Characterization of a Novel
Photoresist Redistribution Material for Advanced Packaging Applications
Warren W. Flack Ultratech, Inc., Elliott Capsuto ShinEtsuMicroSi,
Inc.
Thin Film Heads
An Investigation
of the Properties of Thick Photoresist Films
Gary E. Flores, Warren W. Flack, Elizabeth Tai, Ultratech,
Inc. (SPIE, 1994)
Lithographic Performance
in Thick Photoresist Applications
Gary E. Flores, Warren W. Flack, Elizabeth Tai, Ultratech,
Inc., Chris A. Mack, FINLE Technologies (OCG Microlithography Interface
Conference, 1993)
MEMS
Dual Side Lithography Measurement, Precision and Accuracy
Daniel Schurz, Warren W. Flack, Robert L. Hsieh Ultratech, Inc.(2005)
Process
Characterization of an Ultra-Thick Strippable Photoresist Using
a Broadband Stepper
Warren W. Flack, Scott Kulas, Ultratech, Inc., David W.
Minsek, MicroChem Corp. (SPIE 2000)
Thick Photoresist
Imaging Using A Three Wavelength Exposure Stepper
Bradley Todd, Warren W. Flack, Sylvia White (SPIE MEMS 1999 )
Process
Characterization of One Hundred Micron Thick Photoresist Films
Warren W. Flack, Sylvia White, Bradley Todd, Ultratech,
Inc. (SPIE 1999)
The Optimization and
Characterization of Ultra-Thick Photoresist Films
Warren W. Flack, Warren P. Fan and Sylvia White, Ultratech
(SPIE, 1998)
Advanced Simulation Techniques for
Thick Photoresist Lithography
Warren W. Flack, Gary Newman Ultratech, Inc.
D. Bernard, J. Rey, Y. Granik, V. Boksha, Technology Modeling Associates
(SPIE, 1997)
High Optical Density Photomasks
For Large Exposure Applications
Dan Schurz, Warren W. Flack, Makoto Nakamura Ultratech,
Inc.
1X Lithography for a Micromachined
Accelerometer
Zaulfquar Mohammed, Jeff Farash, Barbara Berthold, Mike Murphy,
Analog Devices, Bradley Todd, Geoff Phillips, Ultratech,
Inc. (SPIE Micromachining & Microfabrication Symposium, 1997)
Photolithography Challenges for the
Micromachining Industry
David Craven, Ultratech, Inc. (BACUS Symposium, 1996)
Imaging and Resist
Technologies for the Micromachining Industry
David Craven, Ultratech, Inc. (SPIE Micromachining &
Microfabrication Symposium, 1996)
Reticles
Simulation Study of Reticle
Enhancement Technology Applications for 157 nm Lithography
Dan Schurz, Warren W. Flack, Linard Karklin (BACUS 2001)
The
Effects of Mask Error Factor on Process Window Capability
Dan Schurz, Warren W. Flack, Simon Cohen, Tom Newman, Khiem Nguyen
(BACUS Symposium 1999)
Reticle Defect Printability
and Photoresist Modeling of Contact Structures
Warren W. Flack, Dan Schurz, Richard Lee and Calvin Ho, Ultratech (SPIE, 1998)
The Printability
of 1X Reticle Defects for Submicron Design Rules
Dan Schurz, Warren W. Flack, Gary Newman, Ultratech, Inc.
(BACUS Symposium, 1997)
Simulation of Sub-Halfmicron
Mask Defect Printability at 1X Reticle Magnification
Warren W. Flack, Gary Newman, Dan Schurz, Ultratech, Inc.
(SPIE, 1997)
Subhalf-Micron Mask Defect Detectability
and Printability at 1X Reticle Magnification
Dan Schurz, Warren W. Flack, Gary Newman, Ultratech, Inc.
(BACUS Symposium, 1996)
Optical Networking
Lithographic Chip Identification:
Meeting the Failure Analysis Challenge
Lynn Dwyer, Kevin Riddell, Ultratech, Inc., Warren Flack,
TRW Inc.
300 mm
Characterization Study of an Aqueous
Developable Photosensitive Polyimide on 300 mm Wafers
Warren W. Flack, Scott Kulas, Ultratech, Inc., Craig Franklin
HD Microsystems
Download a free copy of Adobe Acrobat Reader to view
the papers in PDF.
|
