The NanoTech 160 is Ultratech's second-generation dual side alignment (DSA) stepper utilizing Direct Vision technology. The NanoTech 160 is specifically designed for applications where exposing both the front and backside of the wafer is necessary. Based on its patented Machine Vision System (MVS), Direct Vision incorporates an alignment system capable of aligning to targets on the back of the wafer while exposing features on the front. The NanoTech 160 offers valuable process enhancement features, including a robotic wafer handler, pre-aligner and chuck exclusively designed to handle dual side resist coated wafers with no backside contamination. The handling system is designed to support substrate thicknesses up to 1.2 mm thick and unique software and hardware features have been developed to address the requirements of extremely thick resist processes. In addition, a Windows based operator workstation PC controller offers increased flexibility through a variety of alignment and focus options for improved process performance for dual side alignment applications.

Key Features and Benefits:

• Front and backside alignment capability
• Non-contact lithography
• Ability to place multiple lithography layers on a single reticle
• Pattern recognition alignment system (MVS) eliminates the need for dedicated targets
• High wafer plane irradiance
• Simple integration with existing processes
• Compact system footprint
• A proven projection lithography platform in semiconductor, thin film head and microsystems nanotechnology production environments

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