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As a leading provider of technology solutions, Ultratech
is uniquely positioned to meet both the technical and volume-production
requirements posed by gold and solder bump, and wafer-level
chip-scale packaging (WLCSP) applications, as well as a number
of emerging post passivation technologies. With the introduction
of the Unity PlatformTM, Ultratech’s AP200 and AP300
lithography systems enable our customers to achieve high
process yields on a platform that delivers superior flexibility,
extendibility and cost performance for their advanced packaging
applications. Now more than ever, Ultratech's advanced packaging
product line provides the highly productive, low-cost-of-ownership
solutions capable of meeting customers’ stringent technical
requirements.
Advanced Packaging Products
AP300
AP200
Prisma-ghi
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