The UltraMet 100 is the first DSA alignment metrology tool capable of measuring back-to-front alignment over 100% of the wafer. These measurements enable the control of DSA alignment for increasingly critical MEMS applications, a crucial component for achieving competitive yield in MEMS and other nanotechnology device manufacturing applications. The system is adaptable to a variety of advanced substrates and devices used in the manufacture of power devices, inkjet print heads, microactuators, inertial and pressure sensors, and optical components. Direct Vision detection with Ultratech's patented Machine Vision System (MVS) optics and image capture algorithms ensures reliable image capture and robust measurement capability on a wide variety of processes. Utilizing the MVS system for both back and front side image capture also enables any unique wafer feature to be used for alignment measurements, eliminating the need for dedicated metrology targets.

Key Features and Benefits:

• MVS based dual side overlay measurement system
• No special metrology targets required
• Capable of measuring dual side alignment over entire wafer
• Compact desktop design
• Plug and Play installation
• PC desktop with Windows based operating system
• Compatible with Ultratech’s NanoTech 160 Dual Side Alignment stepper and any backside lithography system

For additional Information on this product please Click Here